Silica Etchant Solutions (Si110F, Si110B and Si110S):
Description:
Lefiq Silica etchant series are Si110F (a Silica etch), Si110B(a Silica Buffer etch) and Si110S, (Silica 3Mix Etch) solution. They are based on the hydrofluoric acid solution. Lefiq are offering them as a working or concentrated solution.
Application:
Majority of Lefiq Silica etchant applications are for etching bare Silica, removing particle residues or for removing traces of photoresist in presence of Silica after application of a photoresist stripper or when utilizing a dry etch. For more information, please contact us.
Cleaning process:
- Process temperature is at room temperature
- Process time is between 20 to 60 sec depending on concentration of HF.
- Mechanically agitating the cleaning solution by Sonication or use of spray system is highly recommended.