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Lefiq thrives to serve its customer's needs and assumes highest priority to resolve its customer issues
Cost-effective Solutions for Semiconductor, Hard Disk Media and Photovoltaic Fabrication
Lefiq's advance technology is backed by the state-of-the-art analytical instruments at its R&D Lab
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ADH6300

Lefiq ADH6300

Description:

Lefiq-ADH6300 is a mixture of low molecular weight organic solvents with zero effects on depletion of Ozone layer.  Application of Lefiq-ADH6300 causes decomposition and dissolution of adhesive material.

Application:

Lefiq-ADH6300 is used to remove hard-to-remove adhesives, specially UV cured adhesives.For More information Please contact us.

Process:

  • Warm Lefiq-ADH6300 cleaning solution to 35 degree C  under the hood
  • Soak your sample inside the Lefiq-ADH6300.  Whipping the glue off the surface using a fine brush will help.
  • Dry samples immediately to eliminate any risk of airborne contamination.