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Lefiq thrives to serve its customer's needs and assumes highest priority to resolve its customer issues
Cost-effective Solutions for Semiconductor, Hard Disk Media and Photovoltaic Fabrication
Lefiq's advance technology is backed by the state-of-the-art analytical instruments at its R&D Lab
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Photoresist Strippers

As a part of fabrication process of a semiconductor wafer, a number of layer removal techniques are used to get rid of any unwanted layers from the surface of a substrate while trying not to introduce any contamination. Photoresist are light-sensitive organic materials which are applied during photo lithography process to form a patterned coating on a surface to protect the underlying inorganic layers during electronic manufacturing steps. The photoresist layer thus need to be removed in the final stage of a manufacturing process.

Photoresist can be stripped away by two different techniques: One by applying a dry etch process using oxygen based plasma, and the other is to apply a wet etch process. For very fine or highly dense electronic devices, dry etch process is the preferred method as problems such as under-cutting or photoresist peeling would not occur. However, a dry etch process is much more expansive compared to a wet etch.

Lefiq Photoresist Strippers Benefits

  1. High Potency
  2. High thermal Stability
  3. High Chemical Stability
  4. High Water Solubility
  5. High Wet-ability Power: 30 Dyn/Cm
  6. Nonflammable
  7. Wide cleaning applications for peeling different types of Photoresists off of underlaying layers

Lefiq Photoresist Strippers Products: