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Post CMP-120Al Cleaner

Lefiq Post CMP-120Al Cleaner:

Description:

The Lefiq Post CMP-120Al cleaner, is an alkaline solution, capable of changing Al2O3 particles to ionic complex of aluminum Al(OH)4-2 which could then easily be repulsed from the surface, due to the existence of strong negative surface zeta potential.

Application:

Cleaning Aluminum Oxide slurry particles after CMP process.  For more information, please contact us.

Cleaning process:

  • Process temperature is at room temperature
  • Process time will be between 30 sec to 2 min depending on population of particles on the surface
  • Wafers or disks must be first rinsed with Di-water to remove all loose particles, then they can be exposed to CMP -Al120.
  • After Post CMP cleaning process, rinse wafers or disks very well with Di-Water.
  • Dry the wafers and disks immediately to eliminate airborne contamination
  • Mechanically agitating the cleaning solution or using a sonication system during cleaning process is highly recommended.